In artificial intelligence and cognitive science, the term situated refers to an agent which is embedded in an environment. The term situated is commonly used to refer to robots, but some researchers argue that software agents can also be situated if: they exist in a dynamic (rapidly changing) environment, which they can manipulate or change through their actions, and which they can sense or perceive. Examples might include web-based agents, which can alter data or trigger processes (such as purchases) over the internet, or virtual-reality bots which inhabit and change virtual worlds, such as Second Life. Being situated is generally considered to be part of being embodied, but it is useful to consider each perspective individually. The situated perspective emphasizes that intelligent behaviour derives from the environment and the agent's interactions with it. The nature of these interactions are defined by an agent's embodiment.
2024–present global memory supply shortage
A global computer memory supply shortage started in 2024 due to supply constraints and rapid price escalation in the semiconductor memory market, particularly affecting DRAM and NAND flash memory. This shortage is sometimes labelled by tech media outlets as "RAMmageddon" or the "RAMpocalypse". Unlike the 2020–2023 global chip shortage, which stemmed primarily from pandemic-related supply chain disruptions from COVID-19, this shortage is driven by a structural reallocation of manufacturing capacity toward high-margin products for artificial intelligence infrastructure, creating scarcity of computer memory in consumer and enterprise PC markets. According to a 2026 Kearney's PERLab analysis, the shortage is expected to last at least until 2030, with CEOs agreeing with the timelines. == Background == Following a severe market downturn in 2022–2023, major memory manufacturers—Samsung Electronics, SK Hynix, and Micron Technology—implemented strategic production cuts to stabilize pricing. By mid-2024, the rapid expansion of generative AI services triggered unprecedented demand for specialized memory products, particularly High Bandwidth Memory (HBM) used in AI accelerators and data center GPUs. Specialized components of semiconductor technology are also experiencing supply constraints due to high demand in AI application. For example, glass cloth, a high-performance glass fiber substrate used for power efficient high speed data transfer and a crucial component of semiconductor manufacturing, is experiencing a supply crisis. Nitto Boseki, a Japanese firm having overwhelming monopoly in its production, is not able to meet increased demands, making chip-makers such as Qualcomm, Apple, Nvidia and AMD compete for securing supply. There are also reports of smaller electronics companies struggling to find suppliers for components such as NAND flash. Memory suppliers are adapting to increased demands and market unpredictability by requiring prepayment or shorter time-frame of payment, which makes it more difficult for smaller firms to acquire capital to survive. By 2026, due to steadily increased demand on resources, CPUs are also experiencing shortage issues due to low fabrication capacity, prioritisation of server CPUs, and increased demand, with CPU prices also being forecast to increase by as much as 15%. The demand on memory has also increased strain on other electronic components such as hard disk devices, with reports such as Western Digital's hard disk supply for 2026 being booked for enterprise applications before February 2026. A 2024 McKinsey analysis projected that global demand for AI-ready data center capacity would grow at approximately 33% annually through 2030, with AI workloads consuming roughly 70% of total data center capacity by the decade's end. In addition, according to Kearney's State of Semiconductor 2025 Report, executives were already expecting a shortage in the <8nm wafer size with memory chips being mentioned as an acute source of concern. Multiple companies mentioned being prepared for it through long-term agreements with RAM suppliers or amassing additional inventory. On 24 March 2026, Google announced TurboQuant, a memory compression technology focused on large language models (LLM) and vector search engines, which it claimed achieves 6x lower memory consumption in tested local LLMs and 8x performance enhancement in tests running on H100 accelerators. The technology is also a drop in enhancement for existing inference pipeline. Amid speculation about memory demand trends, memory manufacturers, SanDisk, Micron, Western Digital and Seagate, among other companies involved in memory manufacture experienced stock price declines. Prices of memory kits also reduced in the following months, although still at inflated prices. == Causes == === HBM production displacement === HBM manufacturing requires significantly more wafer capacity per bit than standard DRAM modules. Industry sources reported that as manufacturers allocated increasing wafer capacity to HBM production to meet contracts with AI infrastructure providers, the supply of conventional DDR4 and DDR5 modules for consumer PCs and smartphones contracted sharply. By September 2025, Samsung Electronics had reportedly expanded its 1c DRAM capacity to target 60,000 wafers per month specifically for HBM4 production, further diverting resources from consumer memory lines. === Geopolitical and trade barriers === The supply chain was further constrained by escalating trade tensions between the United States and China. Throughout 2025, fears of U.S. regulatory backlash and new tariff structures led major manufacturers like Samsung and SK Hynix to halt sales of older semiconductor manufacturing equipment to Chinese entities, effectively capping production capacity in the region. Additionally, proposed tariff policies by the U.S. administration in late 2025 prompted supply chain realignments, with Apple reportedly accelerating plans to source all U.S.-bound iPhones from India to avoid potential levies. === NAND flash capacity constraints === In the NAND flash segment, manufacturers prioritized higher-margin enterprise SSDs for data center applications while phasing out older process nodes more rapidly than anticipated. In November 2025, contract prices for NAND wafers increased by more than 60% month-over-month for certain product categories, with 512GB TLC experiencing the steepest rise as legacy manufacturing capacity was retired. == Impact on industry and consumers == === Manufacturer responses === Major PC manufacturers responded to component cost increases with significant price adjustments and supply chain strategies. Dell Technologies Chief Operating Officer Jeff Clarke stated during a November 2025 analyst call that the company had "never witnessed costs escalating at the current pace," describing tighter availability across DRAM, hard drives, and NAND flash memory. Analysts at Morgan Stanley downgraded Dell Technologies stock from "Overweight" to "Underweight" in late 2025, citing the company's heavy exposure to rising server memory costs. The firm warned that skyrocketing memory prices could significantly erode margins for server and PC OEMs. Conversely, Apple Inc. was reportedly less affected than its competitors, having secured long-term supply agreements for DRAM through the first quarter of 2026. Lenovo Chief Financial Officer Winston Cheng described the cost surge as "unprecedented" and disclosed that the company's memory inventories were approximately 50% above normal levels in anticipation of further price increases. === Consumer electronics sector === The shortage particularly affected smartphone manufacturers and other consumer electronics producers. DRAM prices reportedly rose by 172% throughout 2025, leading manufacturers like Samsung to halt new orders for DDR5 modules to reassess pricing structures and Micron to exit its 'Crucial' brand of consumer products. In Tokyo's Akihabara electronics district, retailers began limiting purchases of memory products to prevent hoarding, with prices for popular DDR5 memory modules more than doubling in some cases. Despite the broad trend of rising hardware costs, some companies engaged in aggressive pricing strategies to maintain market share; for example, Sony reduced the price of the PlayStation 5 by $100 for Black Friday 2025, potentially absorbing increased component costs to stimulate software ecosystem growth. Due to memory prices more than doubling in a single quarter, HP revealed in its Q1 2026 earnings call that memory costs account for 35% of PC build materials up from 15-18% previous quarter. Despite showing strong Q1 2026 earning driven by Windows 11 upgrade cycle and AI PC adoption, HP warned investors of low operating margins and up to double digit percentage decline for coming quarter. Trendforce, an IT analytics company, updated its forecast from 1.7% year-over-year growth in PC market to 2.6% year-over-year decline for 2026, amid backdrop of steadily increasing prices and supply crisis. Research and analytics firms, Gartner and IDC expect worldwide PC market to decline 10-11% and smartphone market to decline 8-9% in 2026. Gartner also projects that rising memory prices will make low-margin entry level laptops under 500 USD financially unviable in two years. The RAM shortage has delayed the release of Valve's second Steam Machine due to increased memory prices. The device was originally set to launch in early 2026. === AI infrastructure competition === Technology companies including Google, Amazon, Microsoft, and Meta Platforms placed open-ended orders with memory suppliers, indicating they would accept as much supply as available regardless of cost, according to Reuters sources. The limited supply of AI chips has been cited as a reason for the slow down in compute growth. In October 2025, OpenAI formally announced a strategic partnership using letters of intent with Samsung Electronics and SK Hynix
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